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description these high intensity white led lamps are based on ingan material technology. a blue led die is coated by a phosphor to produce white. the typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 cie chromaticity diagram. these t-1 3? 4 lamps are untinted, nondifused, and incorpo - rate precise optics producing well defned spatial radiation patterns at specifc viewing cone angle. hlmp-cw15, hlmp-cw16, hlmp-cw23, hlmp-cw24, hlmp-cw30, hlmp-cw31, hlmp-cw70, hlmp-cw72 features ? highly luminous white emission ? 15, 23, 30, and 70 viewing angle applications ? indoor electronic signs and signals ? small area illumination ? legend backlighting ? general purpose indicators beneft ? reduced power consumption, higher reliability, and in - creased optical/mechanical design fexibility compared to incandescent bulbs and other alternative white light sources hlmp-cwxx t-1 3 / 4 precision optical performance white led lamps data sheet caution: these devices are class 1c esd sensitive. please observe appropriate precautions during handling and processing. refer to avago technologies application note an-1142 for additional details.
2 device selection guide min. luminous intensity viewing angle iv (mcd) @ 20 ma part number typ. min. max. standof leads package dimension hlmp-cw15-tw0xx 15 2500 7200 no a hlmp-cw15-tw0xx 15 2500 7200 no a hlmp-cw15-uv0xx 15 3200 5500 no a hlmp-cw15-vwbxx 15 4200 7200 no a hlmp-cw15-vy0xx 15 4200 12000 no a hlmp-cw15-vybxx 15 4200 12000 no a hlmp-cw15-vygxx 15 4200 12000 no a hlmp-cw15-vykxx 15 4200 12000 no a hlmp-cw16-r00xx 15 1500 - yes b hlmp-cw16-tw0xx 15 2500 7200 yes b hlmp-cw16-vy0xx 15 4200 12000 yes b hlmp-cw23-sv0xx 23 1900 5500 no a hlmp-cw23-svkxx 23 1900 5500 no a hlmp-cw23-tw0xx 23 2500 7200 no a hlmp-cw24-sv0xx 23 1900 5500 yes b hlmp-cw24-tw0xx 23 2500 7200 yes b hlmp-cw30-ps0xx 30 880 2500 no a hlmp-cw30-ru0xx 30 1500 4200 no a hlmp-cw30-stbxx 30 1900 3200 no a hlmp-cw30-sv0xx 30 1900 5500 no a hlmp-cw31-m00xx 30 520 - yes b hlmp-cw31-ps0xx 30 880 2500 yes b hlmp-cw31-sv0xx 30 1900 5500 yes b hlmp-cw70-lmbxx 70o 400 680 no a hlmp-cw70-lp0xx 70o 400 1150 no a hlmp-cw72-lp0xx 70o 400 1150 yes b notes: 1. tolerance for each intensity limit is 15%. 2. please refer to an 5352 for detail information on features of stand-of and non stand-of leds.
3 package dimensions 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat d 1.50 0.15 (0.059 0.006) package dimension b 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. notes: 1. all dimensions are in millimeters (inches). 2. epoxy meniscus may extend about 1 mm (0.040") down the leads. cathode lead 2.35 (0.093) max. cathode flat package dimension a hlmp-cw24 d = 12.52 0.25 (0.493 0.010) hlmp-cw16 d = 12.6 0.25 (0.496 0.010) hlmp-cw31 d = 11.96 0.25 (0.471 0.010) hlmp-cw72 d = 12.52 0.25 (0.493 0.010)
4 part numbering system hlmp C c wxx - x x x xx mechanical option 00: bulk dd: ammo pack color bin option 0: full color bin distribution b: color bins 2 & 3 g: color bins 2, 3 & 4 k: color bins 2 & 4 maximum intensity bin limit 0: no maximum intensity bin limit others: refer to device selection guide minimum intensity bin limit refer to device selection guide viewing angle and standof option 15: 15 without standofs 16: 15 with standofs 23: 23 without standofs 24: 23 with standofs 30: 30 without standofs 31: 30 with standofs 70: 50 without standofs 72: 50 with standofs note: please refer to ab 5337 for complete information about part numbering system.
5 absolute maximum ratings t a = 25?c parameter value units dc forward current [1] 30 ma peak forward current [2] 100 ma power dissipation 111 mw reverse voltage (i r = 10 a) 5 v led junction temperature 110 o c operating temperature range C40 to +80 o c storage temperature range C40 to +100 o c notes: 1. derate linearly as shown in figure 5. 2. duty factor 10% frequency 1 khz. electrical characteristics t a = 25c forward voltage, reverse breakdown, capacitance, c (pf), thermal resistance v f (v) @ i f = 20 ma v r (v) @ i r = 10 a v f = 0, f = 1 mhz r j-pin (c/w) typ. max. min. typ. typ. 3.2 3.7 5 70 240 optical characteristics t a = 25c typical chromaticity viewing angle coordinates [1] 2 1/2 degrees [2] part number x y typ. hlmp-cw3x-xxxxx 0.32 0.32 30 hlmp-cw2x-xxxxx 0.32 0.32 23 hlmp-cw1x-xxxxx 0.32 0.32 15 hlmp-cw7x-xxxxx 0.32 0.32 50 notes: 1. the chromaticity coordinates are derived from the cie 1931 chromaticity diagram and represent the perceived color of the device. 2. 1/2 is the of-axis angle where the luminous intensity is 1 ? 2 the peak intensity.
6 figure 6a. cw1x spatial radiation pattern figure 1. relative intensity vs. wavelength figure 3. relative lv vs. forward current figure 5. maximum forward current vs. temperature figure 4. chromaticity shift vs. current wavelength ? nm relative luminous intensity 380 780 1.0 0.6 0 680 580 480 0.4 0.8 0.2 figure 2. forward current vs. forward voltage 0 1.5 0.3 relative luminous intensity forward current ? ma 0 3 0 1.2 10 20 0.9 0.6 relative intensity 1 0 angular displacement ? degrees 0.5 -90 -60 0 -30 30 60 90 -0.010 0.025 0 0.005 -0.005 y-coordinates x-coordinates (x,y) values @ 20 ma reference to (0,0) -0.004 0.004 -0.002 30 ma 5 ma 1 ma 0 0.002 0.015 0.010 0.020 25 ma 20 ma 15 ma 10 ma forward current ? ma 0 0 forward voltage ? v 20 15 2 35 30 5 10 25 1 3 4 m a x i m u m f o r w a r d c u r r e n t - m a 0 0 a m b i e n t t e m p e r a t u r e - c 3 0 6 0 2 5 2 0 1 5 1 0 5 1 0 5 0 8 0 3 5 9 0 2 0 4 0 7 0 3 0
7 figure 6b. cw2x spatial radiation pattern relative luminous intensity 1 0 angular displacement ? degrees 0.5 -90 -60 0 -30 30 60 90 figure 6c. cw3x spatial radiation pattern relative luminous intensity 1 0 angular displacement ? degrees 0.5 -90 -60 0 -30 30 60 90 figure 6c. cw7x spatial radiation pattern relative luminous intensity 1 0 angular displacement ? degrees 0.5 -90 -60 0 -30 30 60 90
8 intensity bin limits (mcd at 20 ma) bin min. max. l 400 520 m 520 680 n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 tolerance for each bin limit is 15%. color bin limit table rank limits (chromaticity coordinates) 1 x 0.330 0.330 0.356 0.361 y 0.360 0.318 0.351 0.385 2 x 0.287 0.296 0.330 0.330 y 0.295 0.276 0.318 0.339 3 x 0.264 0.280 0.296 0.283 y 0.267 0.248 0.276 0.305 4 x 0.283 0.287 0.330 0.330 y 0.305 0.295 0.339 0.360 tolerance for each bin limit is 0.01. 0.40 0.35 0.30 0.25 0.20 0.26 0.30 0.34 0.38 y-coordinate x-coordinate 3 2 4 1 black body curve color bin limits with respect to cie 1931 chromaticity diagram note: bin categories are established for classifcation of products. products may not be available in all bin categories. please contact your avago representative for information on currently available bins. relative light output vs. junction temperature 0 . 1 1 1 0 - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 t j - j u n c t i o n t e m p e r a t u r e - c r e l a t i v e l i g h t o u t p u t ( n o r m a l i z e d a t t j = 2 5 o c )
9 note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. avago technologies high brightness led are using high efciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led confguration note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. ? any alignment fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fxture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led. precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be efectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. 1 . 5 9 m m ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105 c max. - preheat time 60 sec max - peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profle to ensure that it is always conforming to recommended soldering conditions. ca thode ingan device
10 ammo packs drawing 18.00 0.50 (0.7087 0.0197) 6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394) 9.125 0.625 (0.3593 0.0246) 12.70 0.30 (0.50 0.0118) cathode 0.70 0.20 (0.0276 0.0079) 20.50 1.00 (0.807 0.039) a a view a?a ? 4.00 0.20 (0.1575 0.008) typ. all dimensions in millimeters (inches). example of wave soldering temperature profle for th led 0 3 0 1 0 0 2 5 0 2 0 0 1 5 0 1 0 0 5 0 t i m e ( m i n u t e s ) p r e h e a t t u r b u l e n t w a v e l a m i n a r w a v e h o t a i r k n i f e r e c o m m e n d e d s o l d e r : s n 6 3 ( l e a d e d s o l d e r a l l o y ) s a c 3 0 5 ( l e a d f r e e s o l d e r a l l o y ) f l u x : r o s i n f l u x s o l d e r b a t h t e m p e r a t u r e : 2 4 5 c 5 c ( m a x i m u m p e a k t e m p e r a t u r e = 2 5 0 c ) d w e l l t i m e : 1 . 5 s e c - 3 . 0 s e c ( m a x i m u m = 3 s e c ) n o t e : a l l o w f o r b o a r d t o b e s u f f i c i e n t l y c o o l e d t o r o o m t e m p e r a t u r e b e f o r e e x e r t i n g m e c h a n i c a l f o r c e . t e m p e r a t u r e ( c ) 2 0 1 0 4 0 5 0 7 0 9 0 8 0 6 0 refer to application note an5334 for more information about soldering and handling of high brightness th led lamps. note: the ammopacks drawing is applicable to option -dd & -zz and regardless of standof or non standof.
11 packaging box ammo packs note: for ingan device, the ammo pack packaging box contains esd logo. packaging label (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n r e v : d e p t i d : s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 1 m a x t e m p 2 5 0 c from left side of box, adhesive tape must be facing upward. avago technologies anode mother label cathode c a + ? anode lead leaves the box first. label on this side of box.
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies limited. all rights reserved. obsoletes 5989-4125en av02-0214en - april 4, 2008 disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or appli - cations. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. acronyms and defnition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) (ii) avago baby label (only available on bulk packaging) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only p a r t # : p a r t n u m b e r l o t # : l o t n u m b e r m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 1 m a x t e m p 2 5 0 c

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